Plastic heat-set molding

B - Operations – Transporting – 60 – R

Patent

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Details

B60R 13/04 (2006.01) B29C 39/10 (2006.01) B29C 45/16 (2006.01) B29C 70/68 (2006.01)

Patent

CA 2056213

ABSTRACT OF THE DISCLOSURE An apparatus and method of manufacturing a trim strip with a first and second outer heat settable layer molding bonded to a base with an adhesive attaching member. The method includes heating liquid heat settable materials to be bonded to a hard base with an adhesive member at very low pressures to form a trim strip.

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