Polyethylene wax as processing aid for hotmelt adhesive...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 11/08 (2006.01) B32B 7/12 (2006.01)

Patent

CA 2251196

Disclosed is a hotmelt adhesive composition for coating sheetlike structures which comprises hotmelt adhesive powder and a polyethylene wax as processing aid. The polyethylene wax typically has a molecular weight of 500 to 10,000, a melting point of 100 to 130°C and a viscosity at 150°C of 100 to 380 mPa.s and is contained in an amount of 0.1 to 6% by weight based on the powder. The hotmelt powder is typically of polyester, polyamide or high-density polyethylene. Due to the polyethylene wax, processing difficulties of the hotmelt adhesive composition, such as excessive tack, are improved.

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