C - Chemistry – Metallurgy – 07 – D
Patent
C - Chemistry, Metallurgy
07
D
C07D 307/42 (2006.01) B01J 23/04 (2006.01) C07B 61/00 (2006.01) C07D 333/16 (2006.01) C08G 8/04 (2006.01) C08G 59/04 (2006.01) C08G 59/06 (2006.01) C08G 59/62 (2006.01) C08L 61/12 (2006.01)
Patent
CA 2300973
A resin composition having a light weight, a low viscosity, a low hygroscopicity, a high adhesiveness, an excellent thermal resistance and excellent mechanical properties. The resin comprises a polyhydric phenol of general formula (1) and an epoxy resin of general formula (3).
L'invention concerne une composition résineuse présentant un poids léger, une faible viscosité, une faible hygroscopie, une grande adhésivité, une excellente résistance thermique et d'excellentes propriétés mécaniques. La résine comprend un phénol polyhydrique de la formule générale (1) et une résine époxyde de la formule générale (3).
Kajiwara Yoshitaka
Kuboki Kenichi
Oshimi Katsuhiko
Shimamura Yoshio
Watanabe Eiko
Nippon Kayaku Kabushiki Kaisha
Ridout & Maybee Llp
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