C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/221, 402/23
C08G 73/10 (2006.01) C08J 3/12 (2006.01) C08J 5/24 (2006.01)
Patent
CA 1255430
ABSTRACT OF THE INVENTION This invention relates to a polyimide powder in use for adhesion and/or coat forming and to a method of preparing said powder, wherein polyamic-acid is chemically imidized which is obtained by reacting tetracarboxylic acid dianhydride with diamine in organic solvents. This invention further relates to a method for adhesion and coat forming by using said polyimide powder. This invention still further relates to a method for preparing prepreg by using said polyimide powder, and a method for adhesion and preparing molded laminates by using said prepreg.
493009
Ibi Akira
Nakajima Hisae
Sato Takushi
Shishido Shigeyuki
Takahashi Shigeru
Marks & Clerk
Mitsui Chemicals Incorporated
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