Polyimide and high-temperature adhesive of polyimide

Details Polyimide and high-temperature adhesive of polyimide Polyimide and high-temperature adhesive of polyimide

C - Chemistry, Metallurgy

08

G

402/220

C08G 73/10 (2006.01) C09J 179/08 (2006.01)

Patent

CA 1268592

A B S T R A C T Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; (I) Image (II) (where Y is a divalent radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-allphatic radical, monoaromatic radical, condensed polyaromatic radical, and non- condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is Image or Image (III) (IV), Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

515976

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