C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5809
C08L 79/08 (2006.01)
Patent
CA 1339823
This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: (see fig. I) wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, (see figs. II, III, IV and V) The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: (see fig. I) aromatic polysulfone consisting of recurring units of the formula: (see fig. II) or aromatic polyetherimide consisting of recurring units of the formula: (see fig. III)
568192
Iiyama Katsuaki
Kawashima Saburo
Ohta Masahiro
Oikawa Hideaki
Tamai Shoji
Fetherstonhaugh & Co.
Iiyama Katsuaki
Kawashima Saburo
Mitsui Chemicals Inc.
Ohta Masahiro
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