Procede de fixation de lamelles d'un materiau lamellaire sur...

C - Chemistry – Metallurgy – 03 – C

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C03C 17/22 (2006.01) B01J 19/08 (2006.01) C01B 31/04 (2006.01) C03C 21/00 (2006.01) H01L 21/20 (2006.01) H01L 21/336 (2006.01) H01L 21/762 (2006.01) H01L 29/16 (2006.01)

Patent

CA 2701523

The invention relates to a method of fastening lamellae of an at least partially conducting lamellar material to an insulating substrate (2) containing oxides capable of dissociating into mobile ions of a given charge and into fixed ions of opposite charge, which method comprises the steps of: placing a specimen (1) of the lamellar material against a flat surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the specimen to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the specimen.

L'invention concerne un procédé de fixation de lamelles d'un matériau lamellaire au moins partiellement conducteur sur un substrat (2) isolant contenant des oxydes susceptibles de se dissocier en ions d'une charge donnée mobiles et en ions de charge opposée fixes, comportant les étapes de; placer un échantillon (1) du matériau lamellaire contre une surface plane du substrat; provoquer la dissociation des oxydes du substrat; soumettre le substrat et l'échantillon à un champ électrique au moyen d'une électrode en contact avec le substrat et d'une électrode en contact avec l'échantillon.

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