C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/56 (2006.01) C23C 14/34 (2006.01) H01J 37/34 (2006.01)
Patent
CA 2271990
Disclosed is a process for forming a coating on a substrate (2, 2') by cathode sputtering, comprising the coating of substrate surfaces (2, 2') which have been transferred to a cathode sputtering chamber (1). The substrates vary in width and have a predetermined maximum width. The process involves the use of a target (3) whose surface (4) has an invariable length corresponding approximately to said maximum substrate width. A shift takes place, in accordance with the width of the substrate being coated, between the surface (4) of the target and the substrate surface to be coated, so that the entire surface of the target remains more or less constantly in front of the surface to be coated during the cathode sputtering process.
Procédé pour la formation d'un revêtement sur un substrat (2, 2'), par pulvérisation cathodique, comprenant un revêtement de surfaces de substrats (2, 2') transférés dans une enceinte de pulvérisation cathodique (1), qui présentent une largeur variable, avec une largeur maximale prédéterminée, à l'aide d'une cible (3) dont la superficie (4) est d'une longueur invariable correspondant approximativement à ladite largeur maximale du substrat, et, en fonction de la largeur du substrat en cours de revêtement, un déplacement entre la superficie (4) de la cible et la surface à revêtir du substrat de façon que sensiblement la totalité de la superficie de la cible se trouve constamment en face de la surface à revêtir, pendant la pulvérisation cathodique.
Vanden Brande Pierre
Weymeersch Alain
Recherches Et Developpement Du Groupe Cockerill Sambre
Smart & Biggar
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