Process and device for making a product comprising a support...

Details Process and device for making a product comprising a support... Process and device for making a product comprising a support...

B - Operations, Transporting

65

B

154/39, 154/87,

B65B 51/02 (2006.01) B05C 5/00 (2006.01) B05C 5/02 (2006.01) B05C 11/02 (2006.01) B05C 11/10 (2006.01) B31B 1/62 (2006.01) B32B 7/06 (2006.01) B32B 7/12 (2006.01)

Patent

CA 2035478

The process is designed to manufacture a product consisting of a backing (20) with a long-lasting adhesive (2-10) and protection tape (15) for delayed use of the adhesive (2-10). The product may be characterized as follows. The backing (20) including one face (22) receiving the adhesive (2-10) exhibits irregularities. The adhesive (2) is heated to a temperature at which it becomes pasty at the limit of the liquid state and is conducted to at least one hole (4) over a plane (5) on which the backing (20) is placed. Flow is produced at the same time as relative movement between the backing (20) and the hole (4) so that the adhesive (2) is deposited on the backing (20) in at least one continuous thick bead (10). The temperature of the deposited adhesive (2) is lowered to increase its viscosity until it is pasty at the limit of the solid state. Pressure is exerted on the pasty adhesive (2-10) in order to produce lateral spreading and laminating of the bead (10) over its entire length. Then the product, consisting of backing (20), a strip of adhesive (10) and a protection tape (15), receives at least one subsequent cut. See Figure II.

Le procédé est destiné à fabriquer un produit constitué par un support (20) sur lequel se trouvent un adhésif (2-10)) à effet prolongé et un ruban de protection (15) en vue d'un usage différé dudit adhésif (2-10). Il est caractérisé en ce que l'on choisit un support (20) dont une face (22) devant recevoir l'adhésif (2-10) présente des irrégularités, que l'on chauffe l'adhésif (2) jusqu'à une température à laquelle il est pâteux à la limite de l'état liquide, puis qu'on le conduit à au moins un orifice (4) débouchant au-dessus d'un plan (5) sur lequel le support (20) est placé, puis que l'on provoque son écoulement en même temps que l'on provoque un mouvement relatif entre le support (20) et l'orifice (4) afin que l'adhésif (2) se dépose sur le support (20) selon au moins un cordon épais (10), notamment continu, que l'on abaisse la température de l'adhésif (2) déposé pour augmenter sa viscosité jusqu'à ce qu'il soit pâteux à la limite de l'état solide, et que l'on exerce sur l'adhésif pâteux (2-10) une pression destinée à provoquer l'étalement latéral et le laminage du cordon (10) sur toute sa longueur, puis que l'on procède éventuellement à au moins une découpe ultérieure du produit constitué par un support (20), une bande d'adhésif (10) et un ruban de protection (15). (see fig II)

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