Process for applying conductive terminations to ceramic...

Details Process for applying conductive terminations to ceramic... Process for applying conductive terminations to ceramic...

H - Electricity

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334/22.1

H01G 4/12 (2006.01) C04B 37/00 (2006.01) C04B 37/02 (2006.01) C04B 41/69 (2006.01) H01B 1/16 (2006.01) H01C 17/28 (2006.01) H01G 4/232 (2006.01) H01G 4/30 (2006.01) H01G 13/00 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2014947

PROCESS FOR APPLYING CONDUCTIVE TERMINATIONS TO CERAMIC COMPONENTS ABSTRACT OF THE DISCLOSURE In this process a conductive first layer composed of finely divided metal and finely divided ceramic material in an organic carrier is applied to a surface of an unsintered ceramic body. The conductive layer forms terminations when the body, and the conductive layer are cofired to sinter and form a unitary, integral, monolithic structure. A second conductive metal layer may be applied to the first layer prior to cofiring to improve attachment capabilities of the component. Leads may be attached to the conductive terminations if desired.

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