Process for forming multi-level coplanar conductor/insulator...

Details Process for forming multi-level coplanar conductor/insulator... Process for forming multi-level coplanar conductor/insulator...

G - Physics

03

F

356/141, 96/248

G03F 5/24 (2006.01) G03F 7/038 (2006.01) G03F 7/26 (2006.01) G03F 7/30 (2006.01) H05K 1/05 (2006.01)

Patent

CA 2039321

BU9-90-013 PROCESS FOR FORMING MULTI-LEVEL COPLANAR CONDUCTOR/INSULATOR FILM EMPLOYING, PHOTOSENSITIVE POLYIMIDE POLYMER COMPOSITIONS Abstract of to Disclosure Disclosed is a process for producing multi-level conductor/insulator films on a processed semiconductor substrate having a conductor pattern. The insulator layers, each comprise a photosensitive polyimide polymer composition, and this allows the desired wiring channels and stud vias to be formed directly in the insulator layers, without the use of separate masking layers and resulting image transfer steps, thus providing a less cumbersome and costly process.

Affiliated with

Also associated with

Rating

Process for forming multi-level coplanar conductor/insulator... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming multi-level coplanar conductor/insulator..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming multi-level coplanar conductor/insulator... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1854160