G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/26 (2006.01) B41F 5/24 (2006.01) B41N 3/00 (2006.01) G03F 7/11 (2006.01) G03F 7/20 (2006.01)
Patent
CA 2156471
A method for curing a photosensitive resin composition includes use of an especially thin gauge protective cover film, preferably incorporating a coating to permit ease of removal after imaging. The method also uses a photosensitive resin composition incorporating a photospeed modified capping layer to selectively retard image growth during exposure. To eliminate undesirable defects in the cured photopolymer, a glass plate which had previously contacted and flattened the composition, is separated from the composition by at least 0.064 cm (at least 0.025 inches) after partially curing the composition but prior to completely curing the composition. The partial cure of the composition is achieved by directing light to the composition from a source of actinic radiation positioned about 15.2 cm to about 76.2 cm (about 6 to 30 inches) from the resin composition, where the actinic radiation has a wavelength of maximum intensity of about 365 to about 375 nm.
Casaletto Nicola
Gibbons Wayne M.
Rach Joseph F.
Fetherstonhaugh & Co.
Hercules Incorporated
Macdermid Imaging Technology Incorporated
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