Process for tapering openings in glass coatings

Details Process for tapering openings in glass coatings Process for tapering openings in glass coatings

C - Chemistry, Metallurgy

03

C

148/3.5

C03C 15/00 (2006.01) H01L 21/3105 (2006.01)

Patent

CA 1189426

PROCESS FOR TAPERING OPENINGS IN GLASS COATINGS ABSTRACT OF THE DISCLOSURE A process for defining improved tapered openings in glass coatings comprises forming passivating layers of a doped silicon oxide having a relatively low given flow temperature, the layers being formed over the surface of a semiconductor body. After forming contact openings in the doped oxide layer, the layer is heated to a temperature lower than the given flow temperature for a period of time sufficient only to soften and recontour the edges of the contact opening, the lower temperature being insufficient to form a significant oxide growth on the surface of the semiconductor body.

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