Process of manufacturing capacitive devices and capacitive...

H - Electricity – 01 – G

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334/22.1, 334/7.

H01G 4/12 (2006.01) H01G 4/06 (2006.01)

Patent

CA 1259677

ABSTRACT OF THE DISCLOSURE PROCESS OF MANUFACTURING CAPACITIVE DEVICES AND CAPACITIVE DEVICES MANUFACTURED BY THE PROCESS This invention relates to a laminated capacitive element for use in electrical devices such as filtered connectors, said element comprising a laminated body of a metal substrate having one or more layered structures heat bonded to all or a portion of the surfaces thereof, said structures comprising a non-conductive layer composed of a sintered finely divided non-conductive material heat bonded to said metal substrate and a metal conductive layer composed of sintered finely divided metal heat bonded to said sintered non-conductive material.

491235

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