H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) B65D 25/10 (2006.01) B65D 43/16 (2006.01) H05K 7/14 (2006.01) H05K 13/00 (2006.01) B65D 85/30 (2006.01) B65D 85/38 (2006.01)
Patent
CA 2198541
Protective molded resilient flexible plastic package for a printed circuit board with a base and a cover member. The base and cover members have border regions with locking elements to detachably hold base and cover together to close the package. The border regions of one member has a wall which defines a step surface for contacting a marginal region of a surface of the board and a projection spaced from the step surface to engage the other surface of the board when this is in contact with the step surface. The other member has a rigid board engaging element for engaging the other surface of the board when the package is closed.
La présente invention porte sur un emballage moulé pour plaquette de circuits imprimés, composé d'une base et d'un couvercle en plastique résilient. Les bordures de ces deux sections sont munies d'éléments de verrouillage qui permettent de les assujettir l'une à l'autre pour fermer l'emballage. La bordure d'une de ces sections est munie d'une cloison qui forme un palier et met en contact un point précis de la surface de la plaquette de circuits imprimés et un ressaut situé à une certaine distance du palier pour retenir le reste de la surface de la plaquette de circuits imprimés lorsqu'elle s'imbrique dans le palier. L'autre section de l'emballage présente un plateau rigide doté d'un onglet qui retient le reste de la surface du plateau lorsque l'emballage est refermé.
Arsena Biagio
Gordon Randall C.
Robinson Anthony H.j.
Tadge Steve D.
Arsena Biagio
de Wilton Angela C.
Gordon Randall C.
Nortel Networks Limited
Robinson Anthony H.j.
LandOfFree
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