Radiation-sensitive positive resist composition

G - Physics – 03 – F

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G03F 7/023 (2006.01) C07C 39/15 (2006.01) G03F 7/022 (2006.01) G03F 7/038 (2006.01)

Patent

CA 2023791

- 49 - ABSTRACT OF THE DISCLOSURE A positive resist composition comprising 1,2- quinonediazide compound and, as an alkali-soluble resin, an alkali-soluble resin (A) which comprises a resin (I) obtain- able through a condensation reaction of a mixture of m- cresol, 2,3,5-trimethylphenol and optionally p-cresol with an aldehyde and a low moleculer weight novolak (II) having a weight average molecular weight of 200 to 2000 as converted to polystyrene, an alkali-soluble resin (B) which comprises a resin (I) and a compound of the general formula (III): Image wherein R1, R2 and R3 are respectively a C1-C5 alkyl group or a C1-C5 alkoxy group, 1, m and n are respectively a num- ber of 0 to 3, R' is a hydrogen atom or a C1-C3 alkyl group, or an alkali-soluble resin (C) which comprises a resin (IV) obtainable through a condensation reaction of a mixture of m-methoxyphenol and 2,3,5-trimethylphenol in a molar ratio of 80:20 to 30:70 with an aldehyde, which has good sensi- tivity, improved resolution and heat resistance.

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