C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/9438
C08L 23/10 (2006.01) A61L 31/14 (2006.01) C08K 5/06 (2006.01) C08K 5/14 (2006.01) C08K 5/1575 (2006.01) C08K 5/17 (2006.01) C08K 5/3435 (2006.01) C08K 5/51 (2006.01) C08K 5/526 (2006.01) C08L 23/12 (2006.01)
Patent
CA 1254339
- 32 - Abstract Disclosed herein is a radiation-stable polypropylene resin composition having excellent transparency. It contains a polypropylene resin and per 100 parts by weight of the polypropylene resin, 0.005 - 8 parts by weight of a specific sorbitol derivative, 0.01 - 4 parts by weight of a specific phosphite compound and 0.01 - 4 parts by weight of a specific polyamine compound. Excellent molding flowability can be imparted to this resin composition by subjecting it to thermal degradation at 190°C - 270°C in the presence of an organic peroxide until a desired melt index is achieved.
474969
Abe Masaru
Kawai Yoichi
Maki Masami
Sekiguchi Katsumi
Yokote Sachio
Mitsui Toatsu Chemicals Inc.
Sim & Mcburney
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