Rapid solidified soldering filler metals

H - Electricity – 01 – L

Patent

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356/183, 113/83

H01L 23/54 (1985.01)

Patent

CA 1242036

ABSTRACT RAPIDLY SOLIDIFIED SOLDERING FILLER METALS A rapidly solidified, homogeneous soldering foil has a thickness ranging from 12 to 200 micrometers. The foil is at least 2 millimeters wide, of substantially uniform cross section along its length and has a compo- sition consisting essentially of at least two elements selected from the group consisting of Au, Ag, Pb, Bi, Si, Sn, Sb, In and Ge.

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