H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/183, 113/83
H01L 23/54 (1985.01)
Patent
CA 1242036
ABSTRACT RAPIDLY SOLIDIFIED SOLDERING FILLER METALS A rapidly solidified, homogeneous soldering foil has a thickness ranging from 12 to 200 micrometers. The foil is at least 2 millimeters wide, of substantially uniform cross section along its length and has a compo- sition consisting essentially of at least two elements selected from the group consisting of Au, Ag, Pb, Bi, Si, Sn, Sb, In and Ge.
470372
Bedell John R.
Bose Debasis
Datta Amitava
Decristofaro Nicholas J.
Hemmat Naim S.
Gowling Lafleur Henderson Llp
Metglas Inc.
LandOfFree
Rapid solidified soldering filler metals does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Rapid solidified soldering filler metals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rapid solidified soldering filler metals will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1192990