C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
149/14
C09K 13/06 (2006.01) C23F 1/00 (2006.01) C23F 1/18 (2006.01) C23F 1/46 (2006.01)
Patent
CA 1309324
Abstract of the Invention This invention relates to a copper etching process which in- volves contacting the copper with an aqueous etching solution comprising sulfuric acid and a peroxide to which is added less than about 0.2% of an organic additive useful as a crystallization control agent and selected from the group comprising a low mole- cular weight glycol and gum arabic. With this compound present, copper sulfate crystals do not adhere to the tank and removal of the crystals from the bath is facilitated.
562268
Baldauf Walter W. Jr.
Petraitis Kestutis F.
Baldauf Walter W. Jr.
Harshaw-Chemical Company The
M&t Harshaw A. Partnership
Osler Hoskin & Harcourt Llp
Petraitis Kestutis F.
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