Resin composition and layered product

Details Resin composition and layered product Resin composition and layered product

C - Chemistry, Metallurgy

08

L

C08L 29/04 (2006.01) B32B 27/08 (2006.01) B32B 27/28 (2006.01) C08K 3/38 (2006.01) C08L 23/26 (2006.01) C08L 77/00 (2006.01) C08L 77/02 (2006.01) C08L 77/06 (2006.01) C08L 23/08 (2006.01)

Patent

CA 2360443

A resin composition which comprises (A) a saponified ethylene/vinyl acetate copolymer, (B) a polyamide resin having a melting point of 160~C or lower, and (C) a small amount of a boron compound; and a layered product comprising a multilayered molding composed of (X) a layer of the resin composition and (Y) a layer of a thermoplastic resin.

Cette invention concerne une composition à base de résine comprenant (A) un éthylène/vinyle acétate copolymère, (B) une résine de polyamide dont le point de fusion est de 160 ·C ou moins et (C) une faible dose d'un composé au bore. L'invention concerne également un produit en couche constitué par une pièce moulée faite (X) d'une couche de la composition à base de résine et (Y) d'une couche de résine thermoplastique,

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