C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 101/00 (2006.01) B32B 15/08 (2006.01) C08K 3/00 (2006.01) H05K 1/03 (2006.01) H05K 3/46 (2006.01) H05K 1/00 (2006.01)
Patent
CA 2474694
A resin composition excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., especially in high-temperature properties, material for substrates, sheet, laminate, copper foil with a resin, copper-clad laminate, tape for TAB, printed wiring board, prepreg, and adhesive sheet. The resin composition comprises 100 parts by weight of a thermosetting resin and 0.1 to 65 parts by weight of an inorganic compound, and has an average coefficient of linear expansion (.alpha.2) of 17×10-5 [~C-1] or lower in the temperature range of from the temperature higher by 10~C than the glass transition temperature of the resin composition to that higher by 50~C than the glass transition temperature.
Cette invention concerne une composition de résine qui est remarquable en termes de propriétés mécaniques, stabilité dimensionnelle, résistance à la chaleur, ignifugation, etc. singulièrement aux hautes températures, et qui convient comme matériau pour des substrats, des feuilles, des stratifiés, des feuilles de cuivre enduites de résine, des laminés recouverts de cuivre, des rubans pour transport automatique sur bande (TAB), des plaquettes de circuit imprimé, des pré-imprégnés et des feuilles adhésives. Cette composition de résine comprend 100 parties en poids d'une résine thermoplastique et de 0,1 à 65 parties en poids d'un composé inorganique. Elle présente un coefficient moyen de dilatation linéaire (.alpha.2) de 17 x 10?--5¿( ·C?-1¿) ou moins dans la fourchette de températures comprise Tg + 10· C et Tg + 50· C.
Akaho Kazunori
Deguchi Hidenobu
Fujiwara Akihiko
Shibayama Koichi
Yagi Motohiro
G. Ronald Bell & Associates
Sekisui Chemical Co. Ltd.
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