Resin molding method and apparatus

Details Resin molding method and apparatus Resin molding method and apparatus

B - Operations, Transporting

29

C

B29C 45/18 (2006.01) B29C 45/17 (2006.01) B29C 45/38 (2006.01)

Patent

CA 2121013

ABSTRACT OF THE DISCLOSURE To provide a resin molding method and apparatus that may realize a sprue runnerless system with a very simple structure and at a low cost, a molten resin 4 is fed from a resin supply portion 1 into a pair of cavities 3 through a resin passages 2 such as a sprue portion 2A and a pair of runner portion 2B for molding the resin. The method includes the following steps of: moving a resin return member 5 toward the resin supply portion 1 after supplying the molten resin 4 into the cavities 3, the resin return member 5 being disposed so as to be projectable into the resin passage 2 and movable through the resin passage 1; and returning a waste molded resin 6 under a molten/solid condition within the resin passage 2 back into the resin supply portion 1 under a molten condition by a heat of the resin supply portion 1. -1-

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