C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
51/149
C09K 3/14 (2006.01) B28D 1/12 (2006.01)
Patent
CA 1318133
NOVEL SAWBLADE SEGMENTS UTILIZING POLYCRYSTALLINE DIAMOND GRIT ABSTRACT OF THE DISCLOSURE The present invention provides saw blade segments comprising polycrystalline diamond cutting elements and single crystal diamond cutting elements dispersed in a bonding matrix. In a preferred embodiment abrasion resistant particles are included so as to cause non-uniform wearing of the cutting segments. In another aspect of the invention, cutting segments are provided which utilize surface set polycrystalline diamond cutting elements larger than mesh size 18.
610581
Bovenkerk Harold P.
Clark Thomas J.
Deakins Martin E.
Johnson Neil R.
Slutz David E.
Bovenkerk Harold P.
Clark Thomas J.
Company General Electric
Deakins Martin E.
Johnson Neil R.
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