H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/134, 333/7
H01L 27/00 (2006.01) H01L 23/057 (2006.01) H01L 23/498 (2006.01) H01L 23/66 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01)
Patent
CA 1246755
SEMICONDUCTOR DEVICE ABSTRACT OF THE DISCLOSURE A semiconductor device provided with signal lines which connect a chip provided at a top portion of a package with external terminals provided at a bottom portion of the package. The signal lines have portions formed along side surfaces of the package. Ground surfaces are formed at predetermined distances on two sides of the high-speed signal lines. Coplaner waveguide is formed by the high-speed signal lines and the ground surfaces, so the impedance of vertical portions of the high-speed signal lines is matched to the circuits connected thereto.
504584
Emori Shinji
Kitasagami Hiroo
Miyauchi Akira
Nishimoto Hiroshi
Okiyama Tadashi
Fujitsu Limited
Mcfadden Fincham
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