C - Chemistry – Metallurgy – 03 – B
Patent
C - Chemistry, Metallurgy
03
B
C03B 19/10 (2006.01) C03C 11/00 (2006.01)
Patent
CA 2576414
The invention concerns silica microspheres (M) having an outer diameter between 50 and 125 µm, preferably between 60 and 90 µm, a wall thickness not less than 1 µm, preferably between 1 and 3 µm and a density between 0.3 and 0.7/cm3, a manufacturing method by injecting silica microsphere precursors (MS, PR1, PR1', PR2') into an inductive plasma (P), assembly methods and possible uses of silica microspheres.
Microsphères de silice (M) présentant un diamètre extérieur 5 compris entre 50 et 125~m, de préférence compris entre 60 et 90 ~m, une épaisseur de paroi supérieure à 1 ~m, de préférence comprise entre 1 et 3 ~m et une densité comprise entre 0,3 et 0,7g/cm3, procédé de fabrication par injection de précurseurs de microsphère de silice (MS, PR1, PR1', PR2') au sein d'un plasma inductif (P), procédés 10 d'assemblage et utilisations possibles de microsphères de silice.
Rakotoarison Sylvain
Robic
LandOfFree
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