C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 5/14 (2006.01) C08L 83/04 (2006.01) C08L 83/07 (2006.01)
Patent
CA 2348193
A silicone rubber composition for extrusion molding applications has a high cure rate and provides silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to an extremely limited extent. It contains (A) an organopolysiloxane gum, (B) reinforcing silica, (C) diatomaceous earth powder or quartz powder, and (D) an organoperoxide with the formula R - COOOCOO - R1 - OOCOOOC - R, wherein R is a group selected from alkyl, alkoxy, -SiR2 3, -CH2SiR2 3, and -Ph-R3 c (R2 is alkyl or alkoxy; Ph is phenyl when c is 0, and phenylene when c is 1,2 or 3; R3 is alkyl, alkoxy, SiR2 3, or -CH2SiR2 3; and c is 0 to 3) and R1 is Cl1 to Cl0 alkylene. A method is described for fabricating silicone rubber extrusion moldings by curing the silicone rubber composition in a hot gas.
Baba Katsuya
Hirai Kazuo
Honma Hiroshi
Bereskin & Parr
Dow Corning Toray Silicone Co. Ltd.
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