Solder-holding clips for applying solder to connectors

Details Solder-holding clips for applying solder to connectors Solder-holding clips for applying solder to connectors

H - Electricity

01

R

H01R 4/02 (2006.01) H01R 4/48 (2006.01) H01R 43/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2236464

An array and method of forming an array of solder-holding clips (17) is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins (33) of an electrical device, for soldering such pins (33) directly to the conductive pads (41) or internally plated holes (35) of a substrate, or to provide a lead connecting such pins (33) to a substrate.

La présente invention concerne une rangée et un procédé de constitution d'une rangée de pinces à retenue (17) de soudure convenant particulièrement à la fabrication par soudage automatique à matrice progressive, à l'application de soudure en une seule opération à une rangée correspondante de broches de connexion (33) d'un dispositif électrique, au soudage de telles broches (33) directement sur les plages de connexion (41) électroconductrices ou à l'intérieur des trous (35) métallisés d'un substrat, et à la réalisation de conducteur connectant de telles broches (33) à un substrat.

Affiliated with

Also associated with

Rating

Solder-holding clips for applying solder to connectors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder-holding clips for applying solder to connectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder-holding clips for applying solder to connectors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1794402