Soldering apparatus

Details Soldering apparatus Soldering apparatus

B - Operations, Transporting

23

K

B23K 1/08 (2006.01) B23K 1/008 (2006.01) B23K 3/08 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2140843

ABSTRACT This invention provides an improved wave soldering apparatus that protects the molten solder and the components being soldered from exposure to ambient air while the solder is in a liquid condition. At the soldering station, which is enclosed in a controlled atmosphere chamber, all the liquid solder, pumps and other elements exposed to liquid solder are enclosed within the chamber. This eliminates the formation of dross which interferes with the soldering process and also with the operation of the solder pumps. The inlet and outlet paths from the chamber, through which the components pass, are extended both to exclude ambient air and to permit the components to cool in a controlled atmosphere. -5-

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