Soldering device, flux and method

Details Soldering device, flux and method Soldering device, flux and method

G - Physics

01

K

13/6, 116/67

G01K 11/12 (2006.01) B23K 35/36 (2006.01)

Patent

CA 1258755

ABSTRACT OF THE DISCLOSURE The present invention provides a solder joint compris- ing at least two elongate substrates connected together by a mass of solder having associated therewith a substantially colourless solder flux and a temperature indicating component and enclosed within a heat-recovered substantially transparent polymeric mem- ber, the temperature indicating component having changed from a coloured state to a substantially colourless state to enable the connection to be visually inspected.

560042

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