B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 1/08 (2006.01) B23K 3/06 (2006.01) H01F 41/10 (2006.01) H01R 43/02 (2006.01)
Patent
CA 2239963
Method and apparatus by which relative displacement between molten solder and a terminal pin is caused and a coating formed on an end portion of a coil on the terminal is removed by the molten solder, and thus the terminal portion is firmly soldered to the terminal pin after removal of the coating. In contrast, in conventional soldering methods, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is no relative displacement between the pin and the molten solder. Thus, sometimes the coating formed on the coil still remains, so that a complete soldering connection between the terminal pin and the coil is not sufficiently achieved. In accordance with the method and apparatus of the present invention, a full connection therebetween is achieved, and the reliability thereof is enhanced.
Marks & Clerk
Tamagawa Seiki Kabushiki Kaisha
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