C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
C09K 3/00 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01) C08J 3/215 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2094750
ABSTRACT SOLVENT SYSTEM A solvent system contains methoxy acetone, water and, optionally, an oxygen-containing solvent other than methoxy acetone, such as a propylene glycol monoether or diether. The solvent system is a useful solvent for a curing agent for an epoxy resin, a curing catalyst and/or a cure inhibitor. A solution of the curing agent, the curing catalyst and/or the cure inhibitor in the solvent system can be mixed with an epoxy resin, optionally dissolved in a solvent, for producing a one-component epoxy resin composition. C-40,248A
Everett John Peter
Wanzl-Dacho Karin
Zwinselman Jan Johan
Smart & Biggar
The Dow Chemical Company
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