C - Chemistry – Metallurgy – 11 – D
Patent
C - Chemistry, Metallurgy
11
D
C11D 7/06 (2006.01) C11D 7/32 (2006.01) C11D 7/34 (2006.01) C11D 7/50 (2006.01) G03F 7/42 (2006.01) H01L 21/02 (2006.01)
Patent
CA 2642445
Non-aqueous stripping and cleaning compositions for cleaning microelectronics devices, the composition having a least one organic sulfur-containing polar compound as a stripping solvent, at least one water-free source of a strong hydroxide base, and at least one hydroxypyridine stabilizing agent to inhibit detrimental side reactions.
L'invention concerne des compositions de nettoyage et de décapage destinées au nettoyage de dispositifs microélectroniques, lesdites compositions comprenant au moins un composé polaire organique contenant du soufre en tant que solvant décapant, au moins une source exempte d'eau d'une base hydroxyde forte et au moins un agent stabilisateur à base d'hydroxypyridine destiné à inhiber les réactions secondaires indésirables.
Avantor Performance Materials Inc.
Mallinckrodt Baker Inc.
Osler Hoskin & Harcourt Llp
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