C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
204/96.06, 204/1
C23C 14/34 (2006.01)
Patent
CA 1310297
Abstract A sealed substrate processing path has plural selectab- ly isolatable vacuum deposition chambers along the path. A transporter carries substrates along the path and an indepen- dently controllable sputter deposition is performed in each deposition chamber on substrates therein. Substrates are loaded from a load chamber to a first depositon chamber while a vacuum is maintained in the first and load chambers. Sub- strates are transferred from a last deposition chamber to an unload chamber while a vacuum is maintained in the last and load chambers. Substrates are placed in the load chamber while the load and first chambers are isolated and are re- moved from the unload chamber while the last and unload cham- bers are isolated. In one embodiment, substrates travel suc- cessively from the load chamber to first through fourth depo- sition chambers and then to the unload chamber. In another embodiment, substrates travel from the load chamber to first to second to first and to third deposition chambers and then to the unload chamber.
520194
Bloomquist Darrell R.
Drennan George A.
Jacobson Michael B.
Lawton Robert J.
Opfer James E.
Bloomquist Darrell R.
Drennan George A.
Hewlett-Packard Company
Jacobson Michael B.
Lawton Robert J.
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