4. C - Chemistry, Metallurgy
  5. 23
  6. C

James E. Opfer

C - Chemistry – Metallurgy – 23 – C

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Country: United States Of America

Method and target for sputter depositing thin film

C - Chemistry – Metallurgy – 23 – C
Patent

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Method and target for sputter depositing thin film

C - Chemistry – Metallurgy – 23 – C
Patent

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System and method for depositing plural thin film layers on...

C - Chemistry – Metallurgy – 23 – C
Patent

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Method and target for sputter depositing thin film

C - Chemistry – Metallurgy – 23 – C
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

System and method for depositing plural thin film layers on...

C - Chemistry – Metallurgy – 23 – C
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFCA-PAI-P-1084783

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