Tape automated bonding for integrated circuits

Details Tape automated bonding for integrated circuits Tape automated bonding for integrated circuits

H - Electricity

01

L

356/134, 356/141

H01L 21/60 (2006.01) H01L 23/14 (2006.01) H01L 23/556 (2006.01)

Patent

CA 1187625

RADIATION PROTECTION FOR INTEGRATED CIRCUITS UTILIZING TAPE AUTOMATED BONDING ABSTRACT OF The DISCLOSURE A technique is disclosed for protecting integrated circuits from alpha particles. A central portion of a radia- tion resistant insulating substrate upon which electrically conductive leads are disposed is positioned in proximity to the integrated circuit. When the leads are electrically con- nected to the integrated circuit, the central portion of the substrate is allowed to remain over the integrated circuit to protect the integrated circuit. The insulating substrate typically comprises a polyimide film resistant to alpha particles.

407087

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