Tape bonding material and structure for electronic circuit...

Details Tape bonding material and structure for electronic circuit... Tape bonding material and structure for electronic circuit...

H - Electricity

01

L

356/172

H01L 23/48 (2006.01) H01L 21/60 (2006.01) H01L 23/433 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1226967

-23- ABSTRACT An electronic circuit assembly is disclosed including a semiconductor die having an aluminum terminal pad on its top surface. A lead frame is disposed adjacent the semiconductor die and is adapted to be electronically connected to the die. A bided or truckload transfer tape comprising a first member formed from a nickel containing material and a second member formed from a copper containing material interconnects the terminal pad to the lead frame,

472487

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