Target for cathode sputtering

Details Target for cathode sputtering Target for cathode sputtering

C - Chemistry, Metallurgy

23

C

C23C 14/34 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2098725

2098725 9213115 PCTABS00014 A sputtering target and target assembly (12) includes a target member (10) having a substantially continuously concave top surface (17) and a bottom surface (18) with a central, downwardly directed hub (21) and at least three annular regions of differing radius of curvature (23, 27, 25). The shape of the target member (10) bottom surface (18) conforms to a backplate (11) to which it is mounted, thereby facilitating accurate mounting of the target member (10) during sputtering. The corresponding shapes of the target member (10) and backplate (11) promote maximum utilization of sputtering material.

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