Temperature compensation for silicon mems resonator

H - Electricity – 03 – H

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H03H 9/00 (2006.01) H03H 9/50 (2006.01) H03H 9/54 (2006.01)

Patent

CA 2513976

Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

L'invention concerne des variations de fréquence d'origine thermique dans un résonateur micromécanique, compensées activement ou passivement par l'application d'une rigidité de compensation, ou d'une contrainte de compression/tension en compensation. On peut choisir différents matériaux de composition, selon leur coefficient d'expansion thermique, et les utiliser pour former des composants de résonateur sur un substrat. L'exposition à des variations de température engendre une expansion relative des matériaux de composition, qui donne cette rigidité de compensation ou cette contrainte de compression/tension en compensation.

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