Thermocompression bonding in integrated circuit packaging

Details Thermocompression bonding in integrated circuit packaging Thermocompression bonding in integrated circuit packaging

H - Electricity

01

L

356/135, 356/137

H01L 23/495 (2006.01) B23K 20/02 (2006.01) B23K 20/233 (2006.01) B23K 33/00 (2006.01) H01L 21/603 (2006.01) H01L 23/48 (2006.01) H01L 23/482 (2006.01) H01L 23/50 (2006.01)

Patent

CA 2024012

A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

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