Thermoplastic in-mold labeling label structure for...

B - Operations – Transporting – 32 – B

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B32B 27/08 (2006.01) B29C 49/24 (2006.01) B32B 7/10 (2006.01) B32B 27/36 (2006.01) G09F 3/04 (2006.01) B29C 49/04 (2006.01)

Patent

CA 1295222

ABSTRACT OF THE DISCLOSURE A flexible multilayer label adapted for application to de- formable thermoplastic packages, with such label being impervious to water and sufficiently resilient to avoid permanent deformation upon deflection. The label includes a thermoplastic stress- compensating stratum having a relatively elastic structure and a lower surface adapted to be bonded to the outer surface of the thermoplastic package during in-mold labeling procedures. The label further includes a thermoplastic label stratum having a Young's Modulus which exceeds about 7030 Kg/cm2 and a smooth label surface. The label stratum is laminated to the upper surface of the stress-compensating stratum. The stress- compensating stratum structure accommodates the thermal stresses and package shrinkage inherent in such in-mold labeling procedures, as well as stresses imposed by deformation of the package in use. As a result of such accommodating capabilities, the label surface of the label stratum is effectively isolated from such stresses and shrinkage and remains substantially smooth, and the laminated bonds between the label stratum, the stress- compensating stratum, and the deformable package remain substantially intact.

542642

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