Thermoplastic resin-coated metallic substrate and the method...

B - Operations – Transporting – 32 – B

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117/142, 18/774

B32B 15/02 (2006.01) B29F 3/10 (1980.01)

Patent

CA 1098772

ABSTRACT OF THE DISCLOSURE A metallic substrate and a thermoplastic resinous coating are bonded to one another by a resinous hot melt adhesive. The method of applying the coating to effect the bond includes applying, to the metallic substrate a resinous hot melt polyamide adhesive com- position which has been found to adhere firmly to the metallic substrate and to form a secure bond with the molten thermoplastic resin extruded onto said hot melt adhesive at high rates of speed. I

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