Tin-lead alloy plating bath

C - Chemistry – Metallurgy – 25 – D

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204/27.5

C25D 3/56 (2006.01) C25D 3/60 (2006.01)

Patent

CA 1269344

ABSTRACT OF THE DISCLOSURE A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is charac- terized by the addition of a guanamine compound having the general formula Image wherein R1 and R2, which may be the same or different, represent each a hydrogen atom, C1-18 straight- or branched- chain alkyl radical, C1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C3-7 cycloalkyl radical, and R1 and R2 may combine with the adjoining nitrogen atom to form a piperidine, morpholine or piperazine cycle, and A represents a lower alkylene radical.

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