C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/27.5
C25D 3/56 (2006.01) C25D 3/60 (2006.01)
Patent
CA 1269344
ABSTRACT OF THE DISCLOSURE A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is charac- terized by the addition of a guanamine compound having the general formula Image wherein R1 and R2, which may be the same or different, represent each a hydrogen atom, C1-18 straight- or branched- chain alkyl radical, C1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C3-7 cycloalkyl radical, and R1 and R2 may combine with the adjoining nitrogen atom to form a piperidine, morpholine or piperazine cycle, and A represents a lower alkylene radical.
462424
Dohi Nobuyasu
Masaki Seishi
Obata Keigo
Okada Yukiyoshi
Okuhama Yoshiaki
Daiwa Fine Chemicals Co. Ltd.
Gowling Lafleur Henderson Llp
Hyogo Prefecture
Ishihara Chemical Co. Ltd.
LandOfFree
Tin-lead alloy plating bath does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tin-lead alloy plating bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin-lead alloy plating bath will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1243530