Tin, lead, and tin-lead alloy plating baths

Details Tin, lead, and tin-lead alloy plating baths Tin, lead, and tin-lead alloy plating baths

C - Chemistry, Metallurgy

25

D

204/28, 204/39

C25D 3/32 (2006.01) C25D 3/36 (2006.01) C25D 3/56 (2006.01) C25D 3/60 (2006.01)

Patent

CA 1222476

ABSTRACT OF THE DISCLOSURE A tin, lead or tin-lead alloy plating bath, which comprises (A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both; (B) a surfactant comprising, at least one of: (a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts, (b) an amphoteric surfactant selected from betaines; and (c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and (C) at least one of levelling agents selected from the group consisting or alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.

437170

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