Tin nickel-plated cathode

C - Chemistry – Metallurgy – 25 – B

Patent

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204/196, 204/27.

C25B 11/04 (2006.01) C25B 1/00 (2006.01) C25B 1/06 (2006.01) C25D 3/56 (2006.01) C25D 3/60 (2006.01)

Patent

CA 1293953

Abstract of the Disclosure Disclosed is a cathode comprising an active layer composed of a nickel/tin alloy having a nickel content of 25 to 99% by weight, which is formed on the surface of an electrically conductive electrode substrate. When this cathode is used for generating hydrogen by the electrolysis, the hydrogen overvoltage is controlled to a very low level. This active layer is formed by co-electro-deposition of Ni and Sn from a plating solution containing Ni and Sn ions or by thermal decomposition of a mixture containing a nickel compound and a tin compound.

494767

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