Treatment of glass substrates to compensate for warpage and...

C - Chemistry – Metallurgy – 03 – B

Patent

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C03B 32/00 (2006.01) C03B 23/025 (2006.01) C03C 17/02 (2006.01) G02B 6/13 (2006.01) G02B 6/132 (2006.01) H01L 31/18 (2006.01) H01L 33/00 (2006.01) G02B 6/12 (2006.01)

Patent

CA 2202216

A method for forming a substantially flat planar lightwave optical circuit which has a substantially flat planar silica substrate and a sintered glassy lightguiding layer over the silica substrate. The structure is given a post treatment at an elevated temperature for a time sufficient to flatten said structure and compensate for distortion. Alternatively, the silica substrate may be heated and presagged to a predetermined degree to compensate for distortion or warpage which will occur in later processing.

L'invention est une méthode de formation de circuits optiques planar essentiellement plats comportant un substrat de silice planar essentiellement plat et une couche vitreuse frittée de guidage de lumière par dessus le substrat de silice. La structure subit un post-traitement à une température élevée durant une période suffisamment longue pour la rendre plane et en corriger les distorsions. On peut également chauffer le substrat de silice et le précouler à un degré prédéterminé pour compenser la distorsion ou le gondolement qui surviendra dans le traitement ultérieur.

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