Ultrasonic bonding apparatus

B - Operations – Transporting – 29 – C

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154/29.02

B29C 65/08 (2006.01) B29C 65/02 (2006.01)

Patent

CA 1198349

- 17 - ULTRASONIC BONDING APPARATUS Jean Edward Schaefer ABSTRACT An improved ultrasonic bonding apparatus for pattern bonding juxtaposed laminae with a pattern of discrete bonds defined by a multiplicity of discrete pattern protuberances disposed on an anvil as the laminae are forwarded in the machine direction while fixedly associated with the discrete pattern protuberances. In such apparatus having the tip of an ultrasonic transducer biased towards its anvil surface, the discrete pattern protuberances are so configured and disposed on the anvil in its machine direction to obviate cobblestoning of the transducer with respect to the anvil as a patterned portion thereof is moved past the transducer tip; and/or the discrete pattern protuberances are so configured and disposed transverse the apparatus to precipitate wear -- preferably even wear -- of the tip of the ultrasonic transducer of the apparatus along the entirety of a line-of-contact portion thereof. The discrete pattern protuberances may be of various plan-view shapes including but not limited to geometrical or random shape areas, lines or closed linaments and/or combination thereof. The anvil is preferably a rotatably mounted and driven anvil cylinder.

426583

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