Ultrasonic vibration bonding machine

Details Ultrasonic vibration bonding machine Ultrasonic vibration bonding machine

B - Operations, Transporting

23

K

B23K 20/10 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2294553

An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.

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