4. B - Operations, Transporting
  5. 23
  6. K

Seiya Nakai

B - Operations – Transporting – 23 – K

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Inventor

Country: Japan

Support unit for ultrasonic vibration resonator

B - Operations – Transporting – 23 – K
Patent

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Ultrasonic bonding machine

B - Operations – Transporting – 23 – K
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Ultrasonic vibration bonding chip mounter

H - Electricity – 05 – K
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Ultrasonic vibration bonding machine

B - Operations – Transporting – 23 – K
Patent

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Ultrasonic vibration bonding machine

B - Operations – Transporting – 29 – C
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Profile ID: LFCA-PAI-P-1511053

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